Seiko Epson Corporation
Electronic Devices
This protects the TFT panel. Resin is used in the D1 Series or lower, and metal (Mg and Al) is used in the D2 Series or higher. Newly developed mounting frames with radiator fins are used in the D4 Series or higher, which has improved heat radiation. The structure has a high tolerance against frame shrinkage at low temperatures and stress unevenness due to screw compression.
Glass applied to the panel to prevent both damage to the TFT panels and the adhesion of dirt. Any dust that does settle on the dust-proof glass cannot be seen because it is out of focus when the panel is in operation.
Foreign materials on the surface of the panel are de-focused by the dust-proof glass.
FPC is an abbreviation of Flexible Printed Circuit. The circuit is formed on polyester (PET) film by printing or etching. It serves as a transmitter of a variety of signals between devices and the panel, including the power source and picture signal necessary for driving the panel.
It has advantages such as flexibility, flexure, compactness, and high functionality, and it is one of the primary components.
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