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Compact, energy-saving, high-precision technologies

Compact, energy-saving, high-precision technologies

Algorithms for efficient　Every effort is made to develop both the software and the hardware of Epson’s ICs to minimize their power consumption. We offer solutions to maximize the power utilization of your entire system. Low Leakage Current Process　Epson employs its unique low leakage current process technology to substantially reduce the standby current of its ICs. High-density packaging　With wafer chip scale (WCS) packaging and resin-core bump chip-on-glass (COG) mounting technologies, Epson meets your design needs with a variety of small, lightweight, low-profile packages in addition to the standard flat package products. ULTIMICRON　ULTIMICRON is an ultra-compact, high-resolution HTPS TFT color LCD panel created from a combination of the best HTPS, liquid crystal, color filter and high-precision processing technologies. The ULTIMICRON is the ideal solution for electronic viewfinders and other applications that require a compact, high-resolution display. HTPS technology　HTPS panels are polysilicon liquid-crystal displays fabricated in a high-temperature process. On top of high pixel densities and high aperture ratios, miniaturized HTPS panels help make LCD projectors smaller and provide outstanding reliability, resolution and contrast because drivers can be formed directly on the panel substrates. QMEMS　QMEMS are miniature, high-performance crystal devices produced by using a microfabrication process on a quartz material. The word was coined from a combination of Low-power analog IP　Epson uses combinations of low power analog IP cores to enable the low-power analog IC operation required for embedded systems. Compact, energy-saving, high-precision technologies