Products: Quality Information
Quality Management System certification
Epson quickly began working to acquire company-wide ISO certification. Electronic Devices; Semiconductor has acquired ISO9001 and ISO/TS16949 certification with its IC, module and their application products.
ISO9001
| Type of certification | ISO9001: 2008 , JIS Q 9001: 2008 |
|---|---|
| Awarded to | Semiconductor Operations Fujimi Plant, Hino Office, Suwa Minami Plant, Tohoku Epson Corp. |
| Certified by | Bureau Veritas Japan Co., Ltd. |
| Certificate No. | A2064023 |
| Initial Date of Certification | October 10, 1993 |
| Date of expiration | December 10, 2013 |
| ISO9001 certificate (Sakata, Fujimi, Hino, Suwa-minami) |  2,798KB |
| Type of certification | ISO9001: 2008 |
|---|---|
| Awarded to | Singapore Epson Industrial Pte. Ltd. |
| Certified by | SGS |
| Certificate No. | SG03/00011 |
| Date of certification | February 4, 2003 |
| Date of expiration | April 27, 2013 |
ISO/TS16949
| Type of certification | ISO/TS16949:2009 -Third Edition |
|---|---|
| Awarded to | Semiconductor Operations Sakata Plant, Fujimi Plant, Hino Office |
| Certified by | Bureau Veritas Japan Co., Ltd. |
| Certificate No. | 132828 |
| Initial Date of certification | May 9, 2006 |
| Date of expiration | January 5, 2015 |
| ISO/TS16949 certificate (Sakata) |
1381KB |
| Type of certification | ISO/TS16949:2009 |
|---|---|
| Awarded to | Singapore Epson Industrial Pte. Ltd. |
| Certified by | SGS |
| Certificate No. | SG07/00021 |
| Date of certification | June 7, 2007 |
| Date of expiration | April 27, 2013 |
Note; Please scrap the pdf file or print of certificates properly when the date of expiration has passed.
ISO9001:
ISO9001 is an international standard for a product quality system that prescribes demands to the manufactures on a standpoint of customers.
ISO/TS16949:
ISO/TS16949 is an international standard of Quality management system for Automotive industry.
IC Quality Assurance Handbook
Products Credibility Activities
We would set test item and sample depend on not only intended use or usage environment for devices also novelty and priority of products, then we would test reliability evaluation. We would curry out a environment test and mechanical test according to product type. The product specificity is considered in order to adapt various product type and the test condition is set accordingly.
Qualification Test items (example)
| TEST ITEM | TEST CONDITON | TEST DURATION | STANDARD |
|---|---|---|---|
| Temperature cycling (TC) | -65°C to 150°C | 200CYC. |
|
| High Temperature operating life (HTOL) | 125℃ / Vdd-max | 1000h |
|
| High Temperature humidity bias (HTB) | 85℃ / 85％RH | 1000h |
|
| High Temperature storage (HTS) | 150℃ | 1000h |
|
| Low temperature storage | -65℃ | 1000h |
|
| Pressure cooker(Autoclave) | 121℃ / 2.0E5Pa | 200h |
|
| Resistance to soldering heat | Moisture soaking → reflow | 3 Time |
|
| Resistance to solvent (Permanence of marking) *1 |
IPA | 1 Time |
|
*1: Applies to ink mark only
Mechanical Test items (example)
| TEST ITEM | TEST CONDITON | TEST DURATION | STANDARD |
|---|---|---|---|
| Thermal strength (Pull test) |
2.5N, 10 seconds | 1 Time |
|
| Thermal strength (Bending test) | 90 degree bend | 2 Time |
|
| Solderability 1 (Pb free) | Steam Aging → solder dipping | 4h → 245°C, 5seconds |
|
| Solderability 2 (Pb free) | baking → solder dipping | 150°C, 16h → 245°C, 5seconds |
|
ESD Test Procedure
With ICs miniaturization, obvious damages by ESD-Electrostatic-Discharge- are recognized. Epson would carry out ESD test in official standard and approve a product.
In order to determine the susceptibility levels of our device to ESD potential,testing in performed using the test circuit.
- After charging the condenser, switch the "SW" and apply the test voltage on each pins.
- Measure the all electrical parameters and the functions.
- If no failure is found, increase the voltage in steps. Continue testing until failure occurs.
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